KiCad files
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.DS_Store
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*.swp
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@ -18,7 +18,7 @@ for starting this all off.
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3. [Practical considerations](#practical-considerations)
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1. [Parasitic capacitance](#parasitic-capacitance)
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2. [Other notes](#other-notes)
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4. KiCad files
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4. [KiCad files](#kicad-files)
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2. [Hardware (case/plate)](#hardware-caseplate)
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3. [Firmware](#firmware)
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1. [Basic read procedure](#basic-read-procedure)
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@ -131,6 +131,13 @@ I found it important to use a very fast amplifier, opting for the OPA350A.
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Cheaper options proved to be too slow, turning the voltage spike into more of a
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voltage mound, making reading unpredictable.
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## KiCad files
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See `kicad` folder, it contains an example switch footprint and schematic
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library file.
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# Hardware (case/plate)
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The stackup is fairly simple, and is determined by the housing dimensions:
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@ -0,0 +1,33 @@
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(module ToprePad (layer F.Cu) (tedit 5816049C)
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(fp_text reference TP6 (at 0 8) (layer F.SilkS) hide
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value ToprePad (at 0 -8) (layer F.Fab) hide
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_arc (start -8 -8) (end -9 -8) (angle 90) (layer Dwgs.User) (width 0.1))
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(fp_arc (start -8 8) (end -8 9) (angle 90) (layer Dwgs.User) (width 0.1))
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(fp_arc (start 8 8) (end 9 8) (angle 90) (layer Dwgs.User) (width 0.1))
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(fp_arc (start 8 -8) (end 8 -9) (angle 90) (layer Dwgs.User) (width 0.1))
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(fp_line (start 9 -8) (end 9 8) (layer Dwgs.User) (width 0.1))
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(fp_line (start 8 9) (end -8 9) (layer Dwgs.User) (width 0.1))
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(fp_line (start -9 8) (end -9 -8) (layer Dwgs.User) (width 0.1))
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(fp_line (start -8 -9) (end 8 -9) (layer Dwgs.User) (width 0.1))
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(fp_circle (center 0 0) (end 0 -6.5) (layer B.SilkS) (width 1))
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(fp_arc (start 0 0) (end 1 -5.5) (angle 158.5) (layer B.Cu) (width 1.2))
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(fp_line (start 5 -2) (end 4.5 2.5) (layer B.Cu) (width 1.1))
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(fp_line (start 4 -3.5) (end 4 3.5) (layer B.Cu) (width 1.1))
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(fp_line (start 3 -4) (end 3 4.5) (layer B.Cu) (width 1.1))
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(fp_line (start 2 -4.5) (end 2 4.5) (layer B.Cu) (width 1.1))
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(fp_line (start 1 -5.5) (end 1 5.5) (layer B.Cu) (width 1.2))
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(fp_arc (start 0 0) (end -1 5.5) (angle 158.5) (layer B.Cu) (width 1.2))
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(fp_line (start -5 -2) (end -4.5 2.5) (layer B.Cu) (width 1.1))
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(fp_line (start -4 -3.5) (end -4 3.5) (layer B.Cu) (width 1.1))
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(fp_line (start -3 -4) (end -3 4.5) (layer B.Cu) (width 1.1))
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(fp_line (start -2 -4.5) (end -2 4.5) (layer B.Cu) (width 1.1))
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(fp_line (start -1 -5.5) (end -1 5.5) (layer B.Cu) (width 1.2))
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(pad 3 smd rect (at 0 0) (size 0.25 14) (layers B.Cu)
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(zone_connect 2))
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(pad 1 thru_hole circle (at 1 0) (size 1 1) (drill 0.6) (layers *.Cu *.Mask))
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(pad 2 thru_hole circle (at -1 0) (size 1 1) (drill 0.6) (layers *.Cu *.Mask))
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)
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@ -0,0 +1,3 @@
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EESchema-DOCLIB Version 2.0
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#
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#End Doc Library
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@ -0,0 +1,19 @@
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EESchema-LIBRARY Version 2.3
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#encoding utf-8
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#
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# ToprePad
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#
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DEF ~ToprePad TP 0 40 Y Y 1 F N
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F0 "TP" 75 -250 60 H I R CNN
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F1 "ToprePad" -25 -325 60 H I C CNN
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F2 "" 0 0 60 H I C CNN
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F3 "" 0 0 60 H I C CNN
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DRAW
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S 0 150 -125 -150 0 1 0 N
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X S 1 100 100 98 L 50 50 1 1 I
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X R 2 100 0 98 L 50 50 1 1 O
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X G 3 100 -100 98 L 50 50 1 1 W
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ENDDRAW
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ENDDEF
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#
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#End Library
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